Nanolithography and thin film deposition
We have multiple thin film deposition systems, including a recently installed multi-chamber system that combines thermal lithography (Nanofrazor), STM/AFM (RHK Beetle), argon ion milling, and thin film deposition (RF/DC sputtering and e-beam evaporation).
All processes are connected under UHV or inert gas, with the option to transport sample for measurement in vacuum suitcase. As our focus is on spintronics and other electronic devices typical materials deposited include Pt, Au, Py, W, Nb, Al2O3, SiO2, NbN. Materials can be sputtered reactively in oxygen or nitrogen, and/or co-sputtered (up to 6 available targets).
This is complemented by a class 1000 clean room which houses a Durham Optics Microwriter for maskless photolithography and a mask aligner. Electronic devices can also be wire bonded for measurement, and inspected by atomic force microscopy and x-ray reflectometry.