Background
Yi Chen is from Beijing, China. Her undergraduate is in mechanical engineering. She came to Loughborough University to study for a master's degree in 2018, majoring in marketing. Her undergraduate education has laid the groundwork towards the path she now intends to embark on.
The degrees from seemingly vastly different fields endowed her with a solid theoretical background in two diverse fields of mechanical engineering and marketing and place her in a unique position to appreciate the importance of marketing within mechanical engineering.
Now, she is a doctoral researcher at Wolfson School to further her mechanical and electronic engineering studies. Her research interest is microelectronic packaging technology.
With the development of technology, more and more electronic applications need to work or operate at high temperatures, such as the down-hole oil and gas industry for good logging, aircraft, automotive, and space exploration. Currently, common solders on the market are not suitable for high-temperature operations or do not comply with the restriction of hazardous substances (RoHS).
Most of the packaging solutions have been prepared for mild environments and need to be completely redesigned to cope with high-temperature environments. The research is the use of transient liquid bonding technology and liquid solder-Gallium and Ga-based alloys. To achieve low bonding temperature and high operating temperature. It has the potential for enabling the miniaturisation and flexibility of microelectronic devices.