School of Mechanical, Electrical and Manufacturing Engineering


Professor Changqing Liu MSc PhD CEng SMIEEE MIOM3 MInstCT

Photo of Professor Changqing Liu

Professor of Electronics Manufacture


  • BEng (1981-5) in Materials from Nanjing University of Science and Technology China, MSc (1985-8) in Corrosion Wear and Protection from Chinese Academy of Science, and PhD (1993-6) in Engineering Design and Manufacture from Hull University UK.
  • Previously Assistant Professor in the Chinese Academy of Science (1988-93), and Postdoctoral Researcher at Birmingham University (1997-2000).
  • Join Loughborough University since 2000 as a Research Fellow, now Professor of Electronics Manufacture.

Research Interests and Activities

Broad Interests and expertise:
  • Materials and processes in manufacturing
  • Materials characterisation and testing
  • Innovative electronics manufacturing
  • Nano-materials for electronics interconnections
  • Surface science and engineering
  • Corrosion science and protection
Current research areas:
  • Novel materials depositions, bonding assembly processes
  • Large scale ultra-fine pitch flip chip technology
  • Copper interconnects: wire and column bonding and interfaces
  • Wafer bumping with binary and ternary eutectic Pb-free alloys
  • 3D waveguide integration with flexible substrates
  • Printed electronics using ink jet technology
  • Novel materials processing for compact optoelectronics integration
  • Lab on Chip (LoB) to enable multifunctional 3D miniaturised devices
  • Novel materials and processes for manufacture of solar cell modules
  • Electronics for severe, extreme and harsh environments
  • Reliability analysis of electronic products: testing and simulations
  • Surfaces and interfaces of electronics interconnects: microstructural and micro-mechanical characterisation

External Activities

Professional affiliations:
  • Chartered Engineer of Engineering Council, UK
  • Member of Sciece and Technology Task Group, Materials IGT, UK, 2005
  • Senior member of Institute of Electrical and Electronics Engineers, Inc.
  • Member of Institute of Materials, Mineral and Mining
  • Member of Institute of Nanotechnology
  • Member of Institute of Circuit Technology
  • Visiting Professor of Harbin Institute of Technology, China
  • Visiting Professor of Nanyang Technological University, Singapore

Major conference activity

  • Committee member & Session Chair of IEEE international conferences:
  • Electronics Components and Technology Conference (ECTC), USA
  • Electronic Systemintegration Technology Conference (ESTC), Europe
  • Electronics Packaging Technology Conference (EPTC), Singapore
  • International Conference on Electronics Packaging Technology (ICEPT-HDP), China

Invited lectures:

  • The University of Milan, Italy, 21st December 2010
  • Waterloo University, Waterloo, Canada, 16th April 2010
  • Nanyang Technological University, Singapore, 15th December 2009
  • Advanced Industrial Science and Technology (AIST), Tsukuba, Japan, 8th December 2009
  • Huazhong University of Science and Technology, Wuhan, China, 14th October 2009
  • Hong Kong University of Science and Technology, 30th July 2009
  • Shenzhen Graduates School, Harbin Institute of Technology, China, July (2007)
  • KTH, Sweden, November (2006)
  • Chalmers University, Sweden, November (2006)
  • Tsinghua University, Beijing, China,September (2005)
  • Illinois Institute of Technology, Chicago, USA, March (2005)
  • Delft University, Netherlands, November (2004)
  • Harbin Institute of Technology, Harbin, China, July (2004)
  • Institute of Metals Research, Academia Sinica, Shenyang, China, July (2004)
  • The University of Western Ontario, London, Canada, April (2004)
  • University of Science and Technology Beijing, China, July (2002)

Invited papers

‘Materials and Processes Issues in Fine Pitch Eutectic Flip Chip Interconnection ‘, IEEE Transactions on Components and Packaging Technologies, 29/2006:869-876.
6th Conference on High Density Microsystem (HDP’04), Shanghai, China, July (2004)
7thConference on High Density Microsystem (HDP’06), Shanghai, China, June (2004)
NPL SSTC Winter Conference, Teddington, NPL, 10th December (2003)

Journal reviewing
  • Reviewer of IEEE Transactions on Components and Packaging Technologies, IEEE (CPMT) Reviewer of ASME Transactions Journal of Electronics Packaging, ASME, USA
  • Reviewer of Surface & Coatings Technology, Elsevier Science
  • Reviewer of Journal of the Electrochemical Society, The Electrochemical Society, USA
  • Reviewer of Soldering & Surface Mount Technology, Emerald Journal
  • Reviewer of Corrosion Science, Elsevier Science
  • Reviewer of Scripta Materialia, Elsevier Science
  • Reviewer of Materials Letters, Elsevier Science
  • Reviewer of Microelectronics reliability, Elsevier Science
  • Reviewer of Journal of Materials Science and Engineering, Elsevier Science
  • Reviewer of Journal of Alloys and Compounds, Elsevier Science
  • Reviewer of Journal of Applied Polymer Science, Wiley Periodicals, Inc.

PhD thesis examination

An external PhD Examiner at Waterloo University, Canada.
An external PhD Examiner at Birmingham University, UK.


  • Overseas Research Scholarship (ORS), CVCP-UK, 1993-1997.
  • Best Paper Award at 28th IEMT (SEMI, IEEE/CPMT), San Jose, USA, July 2003
  • Cookson Electronics Paper Award at 5th EMAP (IEEE/CPMT), Singapore, November 2003.

Teaching Responsibilities

  • Engineering Sciences 2 (MMA102): Mechanics of Materials
  • Materials and Manufacturing Processes (MMA601/604): Manufacturing Processes
  • Design and Manufacture of Consumer Products (MMF501): Manufacturing Processes
  • Manufacturing Process Technology (MMB600): Responsible Examiner
  • Design for All (MMB504): Group project

Athena Swan Bronze award

Contact us

The Wolfson School of Mechanical, Electrical and Manufacturing Engineering
Loughborough University
LE11 3TU