School of Mechanical, Electrical and Manufacturing Engineering

Staff

David Whalley BSc, MPhil, MIET, CEng, FIMechE, SMIEEE

Photo of  David Whalley

Senior Lecturer

Background

  • Born in Blackburn, Lancashire and attended Ledbury Grammar School, Herefordshire. 
  • Graduated from Loughborough University in 1984 and subsequently worked as a research engineer both at Loughborough University and at the Lucas Advanced Engineering Centre in Solihull, Birmingham.
  • Appointed as a lecturer in 1990 and promoted to Senior Lecturer in 1998. 
  • Visiting Professor, Chalmers University of Technology, Göteborg, Sweden and Nanyang Technological University, Singapore 2001/2002.

University Administration

  • Elected Member of Senate (2006-2009)

Research Interests and Activities

  • Physical realisation of electronic products and other micro-engineered devices, e.g.:
    • Simulation and control of electronics manufacturing processes, such as reflow soldering, conductive adhesive bonding and PCB manufacturing;
    • Materials for electronics packaging and interconnection, including properties of conductive particles in adhesives and high temperature interconnection materials;
    • Thermal design of electronic systems;
    • Reliability, particularly using physics of failure type approaches, including simulation of thermal fatigue in solder joints, effects of contamination and coatings on reliability, reliability of electrical connectors, and how reliability is affected by the manufacturing process.

External Activities

  • Journal editorial board memberships:
    • Editor of Soldering and Surface Mount Technology Journal from 1998 to 2007
    • Associate Editor of the IEEE Transactions on Components, Packaging and Manufacturing Technology: Electronic Packaging Manufacturing since 1996
    • Reviews Editor for the Journal of Electronic Manufacturing from 1991 - 2000
  • Learned society engagement:
    • Chairman of UK & Republic of Ireland Chapter of the IEEE Components, Packaging and Manufacturing Technology Society from 1996 to Feb 2001
    • Elected Member at Large of Board of Governors, IEEE CPMT Society, Jan 2003 – Dec 2005
    • Member of IEEE CPMT Society conferences sub-committee, May 2004 – Dec 2005
  • Professional affiliations:
    • Member of the Institute for Engineering and Technology
    • Fellow of the Institution of Mechanical Engineers,
    • Senior Member of the Institution of Electronic and Electrical Engineers
  • Major conference activity:
    • UK Member of Organising Committee/International Liason - ASME/IEEE/IEPS/JSE International Intersociety Electronic Packaging Conference - INTERpack
    • International Advisory Board Member – EMAP, the International Conference on Electronic Materials and Processes (Conference co-chair – EMAP 2003, Singapore)
    • European Committee Member – IEEE VLSI Packaging Workshop of Japan, Kyoto
    • Member of the IEEE ECTC Conference Materials and Processes Committee
    • Manufacturing Committee chair, IEEE CPMT European Systemintegration Technology Conference
  • Advisory roles:
    • Member of the Industrial Advisory Group for the National Physical Laboratory programme on Encapsulants for Electronics
    • Member of the Industrial Advisory Group for the National Physical Laboratory programme on Electronics Interconnection
    • Grant proposal referee for the Engineering and Physical Sciences Research Council
    • Grant proposal referee for the Hong Kong University Grants Council
  • Referee for the Proceedings of the Institute of Mechanical Engineers, IEEE Transactions, the International Journal of Production Research and the ASME Journal of Electronic Packaging
  • Collaborative Research - current examples include:
    • New Thyristors for T & D Applications (NEWTON), a TSB funded award in collaboration with Dynex, Areva and Semefab.
    • 3D-M-Integration: the design and serial manufacture of 3D miniaturised products, an EPSRC funded project in collaboration with a large network of companies and other universities.
    • Complex Low Volume Electronics Simulation (CLOVES), a TSB funded project in collaboration with Goodrich, GE Aviation, STI, Accelonix, TWI and Warwick University.
    • Design and Simulation of Complex Low Volume Electronics Production (DISCOVER), an EPSRC IeMRC funded project linked to the CLOVES programme.
  • Commercialisation of research:
    • Inventor of the Adaptive Intelligent Reflow (AIR) system licensed to Quad Europe Ltd.
    • Inventor of the technology behind the Rapid Oven Setup system marketed throughout the world by Datapaq Ltd.

Awards

  • 1993: I.Mech.E. Thatcher Bros. Prize for the best paper on a manufacturing industries mechanical engineering subject published in the Proceedings of the Institution that year
  • 1993: I.Mech.E. Donald Julius Groen Prize of the Manufacturing Technology Design and Quality Group
  • 2000: Winner of the Litterati Club highly commended award