Research

Processing

Processing research in the department covers a wide spectrum of materials and process types. Optimisation of material properties are key for successful processing routes and finished products.

The wide range of material types and diverse routes to finished products examined by the processing group are exemplified by the activities below. The research undertaken investigates and optimises both the bulk and surface properties of products so that service lives can be optimised or properties enhanced. Two areas of current interest are:

Research into the causes and behaviors of tin and zinc whiskers which can cause electronic components to short circuit and, in many cases, fail completely. This has led to the development of novel polymeric conformal coatings containing nanoparticles, in conjunction with industry partner HumiSeal.
The development of micro- and nanotechnologies for the production of bioinspired structures with controlled porosity. Electrospinning, 3D printing and phase separation methods are used to process natural and synthetic biopolymers in order to create hierarchical and porous scaffolds for tissue engineering.

Activities we address include but are not limited to:

Polymer Processing
Addititive manufacturing
Electrospinning
Development of porous membranes
Nano particle processing
Electroplating
Conversion coating processes
Anodising
Corrosion protection techniques
Ceramic sintering processes

Bioactive wound dressings based on nanofibres

The current research focuses on the development of micro- and nanotechnologies for the production of bioinspired structures with controlled porosity. Electrospinning, 3D printing and phase separation methods are used to process natural and synthetic biopolymers in order to create hierarchical and porous scaffolds for tissue engineering.

Whiskermit

Tin whiskers present a significant threat to the reliability of electronic components, spanning mobile devices, medical equipment, defense and security hardware, and satellites.

The microscopic filaments – many times finer than a human hair and up to 10mm long – grow spontaneously, causing components to short circuit and, in many cases, fail completely.