Professor Paul Conway

FREng CEng SMIEEE FIMechE

Pronouns: He/him
  • Dean of School
  • Professor of Manufacturing Processes
  • Director, EPSRC Centre for Doctoral Training in Embedded Intelligence

Background

Paul P. Conway received his BEng. degree (Hons.) from the University of Ulster in 1988 and an MSc degree from Loughborough University in 1989. He was an Industrial Engineer with Fisher Body Overseas Corporation, General Motors Corporation and later an NPL funded Research Associate on a project addressing process modelling of reflow soldering, prior to joining the academic staff at Loughborough in 1990 where he became Dean in 2014.

He was Director of the UK’s Research Council’s Innovative Electronics Manufacturing Research Centre (IeMRC) and has held a number of substantial Research Council, European Framework and industrially funded research projects. He has published widely in the field of electronics manufacturing, multifunctional materials manufacturing technology and Industrial IoT.

He has been a member and then Chair of EPSRC’s Strategic Advisory Team for Manufacturing and a member of Panel 12, Engineering in the 2021 Research Excellence Framework exercise. He was elevated to Fellow of The Royal Academy of Engineering in 2021.

Prizes

  • 1988 Institute of Production Engineers, Shorts Bros. plc Prize
  • I.Mech.E Thatcher Bros. Prize: Williams, D.J., Conway, P.P. and Whalley, D.C.,''Making Circuits More Than Once: The Manufacturing Challenges of Electronics Intensive Products'', Proceedings of the Institution of Mechanical Engineers, 207, 1993, pp 83-90, ISSN 0205-1904.
  • I.Mech.E Donald Julius Groen Prize: Williams, D.J., Conway, P.P. and Whalley, D.C., ''Making Circuits More Than Once: The Manufacturing Challenges of Electronics Intensive Products'', Proceedings of the Institution of Mechanical Engineers, 207, 1993, pp 83-90, ISSN 0205-1904.
  • 2003 IEEE/CPMT/SEMI Best paper award at the 28th IEEE IEMTS Conference, San Francisco, Ca., for Huang, Z., Conway, P.P., Liu, C. and Thomson, R.C., ''Inter-dependence of Processing and Alloy Composition on the Reliability of Sn-based Lead-Free Solders in Fine Pitch FCOB Interconnection''
  • 2003 IEEE/EMAP Cookson’s Best Paper Award, Singapore, for Huang, Z., Conway, P.P., Liu, C. and Thomson, R.C., ''Thermodynamic and Kinetic Behaviour of Materials in Micro Joints Formed with Sn-Pb and Pb free Solders''.
  • 2008, Best Paper Prize at IEEE ESTC, Greenwich, London
  • 2012 IEEE-IMAPS, Technology Innovation for embedded RFID, Research to Industry (R2i) Conference, Henry Ford College, Loughborough
  • Innovation Italy Awards, Sustainability, QUID, June 2012, Embedded RFID to enable sustainable manufacture

Paul was the Director of EPSRC’s Innovative Electronics Manufacturing Research Centre and is Director for the EPSRC CDT in Embedded Intelligence. His research includes materials processing; integration of electronics, sensors and actuation into heterogeneous systems; manufacturing technology and processes; process simulation; intelligence and informatics integrated into manufacturing. He has been an investigator on more than £150M of externally funded research from EPSRC, EU, IUK and industry of which £57m has been as principal investigator.

Grants and contracts

  • 2001-03 - EPSRC - Innovation in healthcare combining electronics, drug delivery and information technologies
  • 2003-04 - EPSRC-IMRC - Innovation in healthcare combining electronics, drug delivery and information technologies
  • 1993-96 - EPSRC - Modelling and experimental investigation of reflow soldering
  • 1991-93 - EPSRC - Technology development and evolution: Electronics packaging and interconnect
  • 1999-01 - EPSRC - Flexelec: Large area cost-effective circuits
  • 2003-03 - EPSRC - Towards an innovative electronics manufacturing research centre
  • 2003-08 - EPSRC - An Innovative Electronics Manufacturing Research Centre
  • 2004-2007 - EPSRC-IeMRC - DISCOVER: Design and Simulation of Complex Low Volume Electronics Production
  • 2006-2008 - EPSRC-IeMRC - Design Tools for the Manufacture and Implementation of Pb-Free Solder Joints: Materials Modelling Challenges
  • 2005-2006 - EPSRC-IMCRC - Integration of electrical functionality in mechanical structures for land and air transport: A scoping study for collaborative research
  • 2002-04 - EPSRC-IMRC - Thru-connect: Side-to-side interconnection technology for flexible printed circuits
  • 2003-07 - EPSRC-IMRC - Incorporation of technology trajectories into technology road-mapping within the PRIME domain
  • 2003-06 - EPSRC-IMRC - Manufacturing to end-of-life in lead-free micro joints
  • 2003-04 - EPSRC-IMRC - Packaging of Micro-Electromechanical Systems
  • 2004-05 - EPSRC-IMRC - Moulded interconnect to embed microfluidic devices - a feasibility study
  • 1997-01 - EPSRC - Chip scale soldering technologies based on low-cost flip chip assembly
  • 2001-04 - EPSRC CASE Award - Board level optical interconnect for datacomms
  • 2010-15 - EPSRC - An Innovative Electronics Manufacturing Research Centre
  • 2010-12 - EPSRC KTA - ESPRIT Knowledge Transfer Award: From concept to embodiment
  • 2011-12 - EPSRC KTA - DISCOVER Knowledge Transfer Award: Proof of Concept
  • 2014-23 - EPSRC-CDT - EPSRC Centre for Doctoral Training in Embedded Intelligence
  • 2014-15 - EPSRC-CDT - Centre for Doctoral Training Capital Equipment
  • 2010-13 - EPSRC-IeMRC - High temperature, high vibration microelectronic reliability
  • 2006-11 - EPSRC-IMRC - HPC and Computing Infrastructure Platform
  • 2006-08 - EPSRC-IMRC - Integration of electrical functionality in mechanical structures for land and air transport: a scoping study for collaborative research
  • 2005-11 - EPSRC-IeMRC - IeMRC Doctoral Training Account, 2005-2011
  • 2006-11 - EPSRC-IMRC - IMCRC Interconnection Group Platform Grant
  • 2011-12 - EPSRC-IMRC - Bridging the gaps, MEA systems
  • 2009-13 - EPSRC IMCRC / Filarette - Doctoral training link: Univ Politechnico di Milano
  • 1998-01 - EPSRC - GaAs flip chip packaging for millimetre wave consumer products, with Queens University, Belfast
  • 2005-09 - EPSRC-IMRC - 3D-Mintegration: The design and manufacture of 3D integrated, miniaturised products
  • 2009-14 - EPSRC - ESPRIT with Pervasive Sensing, Programme Grant (led by Imperial)
  • 2011-14 - EPSRC-IeMRC - 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed MEMS components
  • 2014-2018 - EPSRC - Sustainable manufacturing of transparent conducting oxide (TCO) inks and thin films
  • 2016-17 - EPSRC - Robotics and autonomous systems capital equipment phase 2
  • 2021-26 - EPSRC - Re-Imagining Engineering Design: Growing Radical Cyber-Physical-Socio Phenotypes
  • 1996-99 - EPSRC - Electronics manufacturing: new technology in its business context
  • 2001-06 - EPSRC - A centre for innovative manufacturing and construction research (Loughborough IMCRC)
  • 2004-07 - EPSRC - Liquid solder interconnect for high temperature applications
  • 1992-94 - EPSRC - Globalization of electronics manufacture - the growth of an electronics manufacturing industry
  • 2005-08 - EPSRC-IeMRC - Design and simulation of complex low volume electronics production
  • 2004-2007 - EPSRC-IeMRC - Glass Substrates for High Density Electrical and Optical Interconnect
  • 2006-2009 - EPSRC-IeMRC - Integrated optical and electronic interconnect PCB manufacturing
  • 2005-06 - EPSRC-IMCRC - High specification micro and nanotechnology measurement facility
  • 2004-05 - EPSRC-IMRC - Sustainable Manufacture of Recyclable Electronic Products – A Feasibility Study
  • 2005-09 - EPSRC-IMRC - Remedi: Regenerative medicine, a new industry
  • 1998-03 - EPSRC - IGDS Responsive manufacturing, co-applicant with Prof N. N. Z. Gindy et al., Nottingham University
  • 2005-2010 - EPSRC-SRIF3 - Manufacturing and analysis at the micro-nano scale
  • 2000-01 - EPSRC - Strategic Equipment Initiative: Micro-scale testing and analysis facility
  • 2002-03 - EPSRC - Substrates to enable low cost flip chip and optoelectronic device manufacture
  • 2006-11 - EPSRC - A centre for innovative manufacturing and construction research (The IMCRC) Phase 2
  • 2012-14 - EPSRC-IeMRC - Design for Increased Yield for electronics Manufacturing Supply Chain (DIY)
  • 2008-11 - EPSRC-IMCRC - EMBedded totaL lifE coMponents for Product and Process Control – EMBLEM
  • 2008-10 - EPSRC-IMCRC - Force measurement technology feasibility study for swimming turns and starts
  • 2008-11 - EPSRC-IMCRC - Micro electrode arrays for electrophysiology
  • 2008-10 - EPSRC-IMCRC - Intelligent user-centric components for harsh environments
  • 2008-09 - EPSRC-IMCRC - Use of forced convection to control pre-heat in layer-based freeform sintering
  • 2011-2016 - EPSRC - EPSRC Centre for Innovative Manufacturing in Additive Manufacturing
  • 2012-14 - EPSRC-TSB (14218-87248) - Intelligent embedded components for enhanced supply chain observability and traceability: INTELLICO
  • 2001-03 - DTI Foresight Vehicle/EPSRC - e-flex: Maximising the efficiency of urban home delivery
  • 1989-1991 - EPSRC - Technology development and evolution: Electronics packaging and interconnect
  • 2011-12 - EPSRC KTA - EMBLEM KTA: From concept to production ready embedded intelligence
  • 2013-18 - EPSRC - Adaptive informatics for intelligent manufacturing
  • 2013-18 - EPSRC - Knowledge driven configurable manufacturing
  • 2017-22 - EPSRC - Embedded integrated intelligent systems for manufacturing (Platform grant)
  • 1998-00 - TCD & Nortel Networks - Materials jetting technology for advanced interconnect
  • 2010-11 - TSB HVM TP - Electronics manufacturing process advancement towards high yields: Feasibility Project
  • 2012-14 - TSB LVC - Sustainable lightweight low cost battery systems for extended life cycles (EV-Lite)
  • 2011 - EMDA-Inet - iNET (EMDA):University of Nottingham and Loughborough University MEA feasibility award
  • 2005-07 - DTI - Complex low volume electronics simulation
  • 2009-12 - TSB TP HVM - Embedded Enhanced RFID (RFIX) for Printed Circuit Board Manufacture and Added Value Life-cycle Tracking (INBOARD)
  • 2000-02 - European Commission - An environmentally friendly, lead-free joining technology using metal droplets: ‘Droplet Weld’
  • 1998-01 - European Commission - Clean, low distortion, accurate welding of microparts: 'CLAW'
  • 2004-06 - European Commission - Flexible soldering cells for agile electronics manufacture
  • 2011-14 - European Commission - Product remanufacturing service system (PREMANUS)
  • Non-Exec. Director, The Manufacturing Technology Centre, Ansty, Coventry, UK
  • Director, Loughborough University Enterprises Ltd.
  • EPSRC CDT in Embedded Intelligence – Heriot-Watt University
  • Queens University Belfast, University of York on the UKRI Programme Grant ‘Re-imagining Engineering Design’