Development of Novel Functional Intermediate Layers for Power Electronics Integration PhD
- Mechanical, Electrical and Manufacturing Engineering
- Entry requirements:
- 3 years
- 6 years
- Reference number:
- Start date:
- 01 October 2018
- UK/EU fees:
- International fees:
- Application deadline:
- 09 March 2018
in the UK for research quality
in the UK for Mechanical Engineering
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of 2 Queen's Anniversary Prizes
Loughborough University is a top-ten rated university in England for research intensity (REF2014) and an outstanding 66% of the work of Loughborough’s academic staff who were eligible to be submitted to the REF was judged as ‘world-leading’ or ‘internationally excellent’, compared to a national average figure of 43%.
In choosing Loughborough for your research, you’ll work alongside academics who are leaders in their field. You will benefit from comprehensive support and guidance from our Doctoral College, including tailored careers advice, to help you succeed in your research and future career.
Power electronics are widely used in electric and hybrid vehicles (EHV), aerospace crafts, renewable power components and traction control systems. At present, the rapid development in construction of power modules which is somewhat restricted by high switching frequency, high reliability and low loss requires heterogeneous integration. The uses of Wide Band Gap (WBG) such as SiC devices are also limited by the packaging technologies. This demands a cost effective route of implementing the necessary 3D structures needed to contain the EMI, address the thermal management and offer a more robust and reliable packaging solution. This PhD project will focus on the packaging and integration technologies through the use of functional intermediate layers to enhance electrical, thermal and mechanical performance enabling a timely need to make a leap forward for the future use of these devices. This will be achieved by the development of different functional inter-layers and heterogeneous integration to enable robust multi-material, multi-functional embedded structures. Numerical modelling as well as materials characterisation techniques will be utilised to qualify the functionalised surfaces as well as the resultant interfaces in the course of interaction and evolution of the integrated structures. Successful candidates will join an interdisciplinary team with substantial industrial engagement and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future enabling technologies for wide range of power electronics devices.
Primary supervisor: Changqing Liu
Applicants should have, or expect to achieve, at least a 2:1 Honours degree (or equivalent) in materials science, engineering, chemistry, physics or a related subject.
A relevant Master’s degree and/or experience in one or more of the following will be an advantage: electronics interconnects and testing (e.g. under multi-parametric coupled loadings including stress/strain, thermo-, electro- or magnetic), materials deposition/bonding and interfacial characterisation, preferably with skills and previous experience of numerical modelling using advanced software packages, especially those who has had track record of publications in their respective field.
All students must also meet the minimum English Language requirements.
Fees and funding
Tuition fees cover the cost of your teaching, assessment and operating University facilities such as the library, IT equipment and other support services. University fees and charges can be paid in advance and there are several methods of payment, including online payments and payment by instalment. Special arrangements are made for payments by part-time students.
This is an open call for candidates who are sponsored or who have their own funding. If you do not have funding, you may still apply, however Institutional funding is not guaranteed. Outstanding candidates (UK/EU/International) without funding will be considered for funding opportunities which may become available in the School.
How to apply
All applications should be made online. Under programme name select Mechanical and Manufacturing Engineering. Please quote reference number: CL2UF2018