Advanced manufacturing processes to enable the heterogeneous integration of power electronics PhD
- Mechanical, Electrical and Manufacturing Engineering
- Entry requirements:
- 3 years
- 6 years
- Reference number:
- Start date:
- 01 October 2018
- UK/EU fees:
- International fees:
- Application deadline:
- 09 March 2018
in the UK for research quality
in the UK for Mechanical Engineering
The Complete University Guide 2018
of 2 Queen's Anniversary Prizes
Loughborough University is a top-ten rated university in England for research intensity (REF2014) and an outstanding 66% of the work of Loughborough’s academic staff who were eligible to be submitted to the REF was judged as ‘world-leading’ or ‘internationally excellent’, compared to a national average figure of 43%.
In choosing Loughborough for your research, you’ll work alongside academics who are leaders in their field. You will benefit from comprehensive support and guidance from our Doctoral College, including tailored careers advice, to help you succeed in your research and future career.
Heterogeneous integration of power devices refers to the assembly of separately manufactured power semiconductors, passive components and control elements into a single package, i.e. System in Package (SiP) that, in the aggregate, provides increased functionality, enhanced reliability and reduced cost. The integration of the next generation wide-band gap (WBG) power devices has, nevertheless, been bottlenecked by prevailing manufacturing technologies, which are unlikely to offer a cost-effective way of implementing the necessary 3D structures needed to contain the electromagnetic interference (EMI), address the thermal integration issues and offer a more robust and reliable packaging solution. This PhD project will focus on the development of novel structural embedding methodology and 3D multi-material architecture, using various processing methods such as subtractive lithography, additive manufacturing, patterned deposition (e.g. electrolytic and electroless plating) and precision micro-machining, and with emphasis on the thermal and electrical reliability of the integration system. Successful candidates will join an interdisciplinary team with substantial industrial exposure and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future high value added hybrid electronics.
Primary supervisor: Changqing Liu
Applicants should have, or expect to achieve, at least a 2:1 Honours degree (or equivalent) in materials science, engineering, chemistry, physics or a related subject.
A relevant Master’s degree and/or experience in one or more of the following will be an advantage: electronics manufacturing, materials characterisation, electrochemical processes, and surface coating technologies. Previous research experience in at least one of these research areas is desirable, especially those who has had track record of publications in their respective field.
All students must also meet the minimum English Language requirements.
Fees and funding
Tuition fees cover the cost of your teaching, assessment and operating University facilities such as the library, IT equipment and other support services. University fees and charges can be paid in advance and there are several methods of payment, including online payments and payment by instalment. Special arrangements are made for payments by part-time students.
This is an open call for candidates who are sponsored or who have their own funding. If you do not have funding, you may still apply, however Institutional funding is not guaranteed. Outstanding candidates (UK/EU/International) without funding will be considered for funding opportunities which may become available in the School.
How to apply
All applications should be made online. Under programme name select Mechanical and Manufacturing Engineering. Please quote reference number: CL1UF2018