Projects
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Theme details |
| Click on theme title for full details, abreviations are shown in brackets and used in projects table to indicate primary, secondary and tertiary fit to themes. |
| Manufacturing Business Processes (MBP) |
| Sustainable Manufacture, Products and Processes (SMPP) |
Design for X (DfX) |
| Challenging Environments: New Application Areas(CE:NAA) |
Materials, Manufacturing Processes & Technology (MMP&T) |
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Flagship Projects
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Status |
Themes addressed |
Contact |
Publications
please use the click here links for publication list per project |
Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE)
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Ongoing |
MMP&T |
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Uni. of Oxford
Dr H Assender |
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Smart Microsystems
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Ongoing |
MMP&T |
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Optical Printed Circuit Board Manufacturing
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Complete |
MMP&T |
DFX |
CE:NAA |
Loughborough Uni.
Dr D Hutt
Heriot-Watt Uni.
Prof A Walker
|
click here |
Power Electronics
|
Complete |
DFX |
MMP&T |
CE:NAA |
|
click here |
| |
Standard Projects
|
Status |
Themes addressed |
Email Contact |
Publications |
3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed MEMS components
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Ongoing |
MMP&T |
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Costing for Avionic Through Life Availability (CTA)
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Ongoing |
MBP |
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Design for Increased Yield for the Electronics Manufacturing Supply Chain (DIY)
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Ongoing |
MBP |
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High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communications
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Ongoing |
DFX |
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High-performance low-cost power modules for energy smart network applications
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Ongoing |
SMPP |
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Micro-interconnects Using Mono-sized Polymer Microspheres for Large Format High Resolution Sensor Packaging
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Ongoing |
MMP&T |
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click here |
Sustainable Ultrasonic Electroless & Immersion Plating Processes for Photovoltaic & PCB Manufacture
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Ongoing |
SMPP |
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Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging
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Ongoing |
MMP&T |
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WHISKERMIT: Manufacturing and in-service tin whisker mitigation strategies for high value electronics
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Ongoing |
CE:NAA |
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A Prognostic and Diagnostic Environment for High Reliability Electronic Systems
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Complete |
DFX |
CE:NAA |
MMP&T |
Nottingham Uni. Prof Mark Johnson |
click here |
| International secondment support: Cost Estimating for Low Volume Long Life Products in Electronic Defence Systems: CALCE visit |
Complete |
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click here |
Design and Simulation of Complex Low Volume Electronics Production
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Complete |
MBP |
DFX |
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Loughborough Uni. Prof A West |
click here |
Design for Manufacture Methodology for System in Package Technology
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Complete |
DFX |
CE:NAA |
MBP |
Lancaster Uni.
Prof A Richardson |
click here |
Frequency Agile Microwave Bonding System (FAMOBS)
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Complete |
MMP&T |
DFX |
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Heriot-Watt Uni.
Prof M Desmulliez |
click here |
| Fullerene Chemically Amplified Resists for Next Generation Lithography |
Complete |
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Dr A Robinson |
click here |
Glass Substrates for High Density Electrical and Optical Interconnect
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Complete |
MMP&T |
SMPP |
DFX |
Loughborough Uni. Dr David Hutt |
click here |
Integrated Health Monitoring of MNT Enabled Integrated Systems
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Complete |
DFX |
CE:NAA |
MMP&T |
Heriot-Watt Uni
D. Wang |
click here |
Nanoparticle Stabilized Solder Materials for High Reliability Applications
|
Complete |
MMP&T |
CE:NAA |
SMPP |
Kings College London
Prof S Mannan |
click here |
Novel high energy density, high reliability capacitors
|
Complete |
MMP&T |
CE:NAA |
DFX |
|
click here |
The Evaluation of Sonochemical Techniques for Sustainable Surface Modification in Electronic Manufacturing
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Complete |
MMP&T |
SMPP |
MBP |
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Thin-film deposition and laser patterning for high volume manufacture of electrical structures
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Complete |
MMP&T |
SMPP |
DFX |
|
click here |
Through Life cost estimating within defence systems
|
Complete |
MBP |
DFX |
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Uni. of Bath
Dr L Newnes |
click here |
| |
Feasibility Studies |
Status |
Themes addressed |
Email Contact |
Publications |
Electrochemically assisted integration of organic semiconductors on CMOS and MEMS |
Ongoing |
MMP&T |
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Challenges for electronic manufacturing posed by new surface contamination failure modes
in the context of the wireless revolution
|
Complete |
CE:NAA |
MMP&T |
MBP |
Loughborough Uni. Mr D Whalley |
click here |
Chemically Amplified Molecular Resists for Electron Beam Lithography
|
Complete |
MMP&T |
SMPP |
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Uni. of Birmingham |
click here |
Design Tools for the Manufacture and Implementation of Pb-Free Solder joints:
Materials Modelling Challenges
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Complete |
DFX |
SMPP |
MMP&T |
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Development and manufacture of transparent, electrically conductive, flexible plastics
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Complete |
MMP&T |
DFX |
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C. Lekakou |
click here |
FAMOBS: Frequency agile microwave open-oven bonding system
|
Complete |
MMP&T |
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Heriot-Watt Uni.
Prof M Desmulliez |
click here |
Lithographically Printed Integrated Electronics
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Complete |
MMP&T |
SMPP |
DFX |
Loughborough Uni. Dr D Southee |
Click here |
Lithographically Printed Voltaic Cells
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Complete |
SMPP |
MMP&T |
MBP |
Loughborough Uni. Dr D Southee |
click here |
Manufacturing Electronic Devices Using Embossing & Microcontact Printing
|
Complete |
MMP&T |
SMPP |
DFX |
Brunel Uni. |
click here |
Microemulsion Fabrication of Nanoparticles for Enhanced Solder Materials
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Complete |
MMP&T |
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Kings College London
Prof S Mannan
|
click here |
Micro-Materials Integration & Evolution in Digital Electronics Manufacturing
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Complete |
MMP&T |
SMPP |
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Loughborough Uni. Prof C Liu |
click here |
Scoping study of laser patterning of thin-films for high volume manufacture of electrical structures
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Complete |
MMP&T |
SMPP |
DFX |
Brunel University |
click here |
Scoping Study: The Rapid Assessment of Electronic Product Enclosure Plastics
for Manufacturing Support and End-of-Life Management
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Complete |
SMPP |
MMP&T |
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Studentships
|
Status |
Themes addressed |
Email Contact |
Publications |
Development of high performance permalloy cored inductors for integration with IC technology
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Ongoing |
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Electroprinting & Electrospinning of electrically conductive, transparent, flexible plastic nanocomposites
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Ongoing |
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Fusion of ultrasound & X-ray data for inspection of modern microelectronic packages
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Ongoing |
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Harsh environments interconnect
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Ongoing |
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Ion implanted Bragg grating filters in silicon
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Ongoing |
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CFD Technology development for electro-mechanical systems
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Complete |
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Controlled Thermoplastic Polymer Adhesion to Materials Used in Electronics
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Complete |
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Dynamic system modeling and performance optimization of a distributed generation power pack
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Complete |
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Micro-interconnections Using Single Crystals
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Complete |
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click here |
Molecular junctions - made to measure
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Complete |
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click here |
Non-invasive ‘safety agents’ for embedded processors
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Complete |
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Piezo-electric transformers for power electronic applications
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Complete |
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click here |
Power PC Thermal Management and Performance Modelling
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Complete |
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The investigation of the use of advanced sensing technologies for protection suits
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Complete |
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click here |
Under bump metallization technologies for high sensitivity spectroscopic X-ray detectors
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Complete |
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|
click here |
