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Integrated health monitoring of MNT enabled integrated systems (I-Health)
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AUTHOR(S)
TITLE
JOURNAL/CONFERENCE
YEAR
VOL.
PAGE
Y. Liu, J. Zeng and C. H. Wang Accurate temperature monitoring in laser-assisted polymer bonding for MEMS packaging using an embedded microsensor array IEEE/ASME Journal of
Microelectromechanical
Systems		 2010 19 903 - 910
C. H. Wang, Y. Liu and
A. R. Richardson		 Integrated sensors for health monitoring in
advanced electronic systems		 Proc. the 4th IEEE International design and test workshop (Riyadh) 2009    
C. H. Wang, Y. Liu and J. Zeng Recent advances in laser-assisted polymer bonding for MEMS packaging Proc. the 10th IEEE international conference on electronic packaging technology and high
density packaging (Beijing)		 2009   31 - 35
Y. Liu, J. Zeng and C. H. Wang In-situ temperature monitoring for process control in laser assisted polymer bonding for MEMS packaging Proc. the 2nd IEEE electronics systemintegration technology
conference (Greenwich)		 2008   199 - 204
Y. Liu, J. Zeng and C. H. Wang Temperature monitoring in laser assisted polymer bonding for MEMS packaging using a thin film sensor array Proc. IEEE Sensors Applications Symposium (New Orleans) 2009   52 - 55
Y. Li, B. W. Flynn, W. Parkes, Y. Liu, Y.
Feng, A. D. Ruthven, J. G Terry, L. I. Haworth, A. Bunting, J. T. M. Stevenson, S. Smith, P. Bobbili, Y. Q. Fu and A. J. Walton		 The integration of EWOD and SAW technologies for improved droplet manipulation and mixing Proc. the European solidstate
device research conference (Athens)		 2009   371 - 374
Y. Liu, J. Zeng and C. H. Wang Temperature monitoring in laser bonding for MEMS packaging Proc. IMAPS-UK Microtech conference (Edinburgh) 2009   87 - 90
   

 

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