Project Publication List

Frequency Agile Microwave Bonding System (FAMOBS)
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AUTHOR(S)
TITLE
JOURNAL/CONFERENCE
YEAR
VOL.
PAGE
G. Goussetis, K. I. Sinclair, A. J. Sangster, M. P. Y. Desmulliez, T. Tilford, C. Bailey and A. K. Parrott. Microwave Curing for High Density Package. 9th IEEE CPMT Symposium 2007   30
T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. Y. P. Desmulliez, A. K. Parrott and A. J. Sangster. Numerical Simulation of Encapsulant Curing within a Variable Frequency Microwave Processing System Proc. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-systems 2008   447 - 454
T. Tilford, C. Bailey, A.K. Parrott, J. Rizvi, C. Yin, K.I. Sinclair and M.P.Y. Desmulliez. Impact of Assembly Processes on Polymer Materials in Electronic Packaging, Proceedings ICEPT-HDP 2008    
K. I. Sinclair, G. Goussetis, M. P. Y. Desmulliez, A. J. Sangster, T. Tilford, C. Bailey and A. K. Parrott. Polymer Curing within an Open-Ended Microwave Oven EuMW 2008    
K. I. Sinclair, T. Tilford, G. Goussetis, C. Bailey, M. Y. P. Desmulliez, A. K. Parrott and A. J. Sangster. Advanced Microwave Oven for Rapid Cure of Encapsulants ESTC 2008    
T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P. Y. Desmulliez, A. K. Parrott and A. J. Sangster. Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing Proceedings International Spring Seminar on Electronics Technology 2008   176 - 177
T. Tilford, K. I. Sinclair, C. Bailey, M. P. Y. Desmulliez, A. K. Parrott, A. J. Sangster Coupled FDTD-FVM Simulation of Microwave Heating of Polymer Materials for Micro-Systems Packaging Applications Proceedings 41st International Microwave Power Institute Symposium 2007    
T. Tilford, K. I. Sinclair, C. Bailey, M. P. Y. Desmulliez, A. K. Parrott and A. J. Sangster Coupled FDTD-FVM Simulation of Microwave Heating of Polymer Materials for Micro-Systems Packaging Applications Proceedings of Electronics Packaging Technology Conference 2007   791 - 796
K. I. Sinclair, M. P. Y. Desmulliez, A. J. Sangster, G. Goussetis, T. Tilford, C. Bailey and A. K. Parrott Open-Ended Microwave Oven for Flip-Chip Assembly IEEE Proc. European Microwave Conference 2007   620 - 623
K. I. Sinclair, T. Tilford, M. P. Y. Desmulliez, G. Gousettis, C. Bailey, A. K. Parrott and A. J. Sangster. Open Ended Microwave Oven for Packaging Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS 2008   16 - 20
T. Tilford, K. I. Sinclair, C. Bailey, M. P. Y. Desmulliez, A. K. Parrott and A. J. Sangster. Multiphysics Simulation of Microwave Curing of Polymer Materials in Microelectronics Packaging Applications Proceedings 11th International Conference on Microwave and High Frequency Heating 2007   189 - 192
   

 

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