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Glass Substrates for High Density Electrical and Optical Interconnect |
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AUTHOR(S) |
TITLE |
JOURNAL/CONFERENCE |
YEAR |
VOL. |
PAGE |
| X. Cui, D. Bhatt, F.M. Khoshnaw, D.A. Hutt, P.P. Conway | Glass as a Substrate for High Density Electrical Interconnect |
Electronic Packaging Technology Conference (EPTC), Singapore |
2008 |
12 | |
| D.A. Hutt, K. Williams, P.P. Conway, F.M. Khoshnaw, X. Cui, D. Bhatt | Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect |
Circuit World |
2007 |
33(1) | 22 |
| X.Cui, D.A. Hutt, P.P. Conway | An Investigation of Electroless Copper Films Deposited on Glass |
Electronic Systemintegration Technology Conference, (ESTC), Greenwich |
2008 |
105 | |
| X. Cui, D. Bhatt, D.A. Hutt, K. Williams, P.P. Conway | Copper Deposition and Patterning for Glass Substrate Manufacture | Electronic Packaging Technology Conference (EPTC), Singapore | 2007 | 37 | |
| F.M. Khoshnaw, D.A. Hutt, P.P. Conway, K. Williams | Glass Multilayer Lamination for PCB Manufacture Using Pressure Assisted Low Temperature Bonding | Electronic Packaging Technology Conference (EPTC), Singapore | 2007 | 504 | |
| D. Bhatt, K. Williams, D.A. Hutt, P.P. Conway | Process Optimization and Characterization of Excimer Laser Drilling of Microvias in Glass | Electronic Packaging Technology Conference (EPTC), Singapore | 2007 | 196 | |
| D. Bhatt, D.A. Hutt, P.P. Conway | Excimer Laser Micromachining of Glass Substrates | CLEO Conference, USA | 2008 | ||
| X. Cui, D.A. Hutt, P.P. Conway | Investigation of the Adhesion of Electroless Copper to Glass Substrates | Materials Research Society Fall Meeting, Boston, USA | 2008 | ||
| D.A. Hutt, K. Williams, P.P. Conway, F.M. Khoshnaw, X. Cui, D. Bhatt | Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect | Electronic Systemintegration Technology Conference (ESTC), Dresden | 2006 | 1279 | |
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