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AUTHOR(S) |
TITLE |
JOURNAL/CONFERENCE |
YEAR |
VOL. |
PAGE |
| H Lu, C Bailey, and CY Yin | Design for reliability of power electronics modules | Microelectronics Reliability | 2009 | 49 | 1250-1255 |
| H Lu, T Tilford, C Bailey, D Newcombe | Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect | HDP'07 | 2007 | 40-45 | |
| Nishad Patil, Diganta Das, Chunyan Yin, Hua Lu, Chris Bailey and Michael Pecht | A Fusion Approach to IGBT Power Module Prognostics | Eurosime | 2009 | 215 - 220 | |
| D. Newcombe, C. Bailey, H. Lu | Solutions for Application Specific IGBT Module Design | PCIM 2007 | 2007 | ||
| C. Bailey, T. Tilford, and H. Lu | Reliability Analysis for Power Electronics Modules | ISSE2007 | 2007 | ||
| C. Bailey, H. Lu and T. Tilford | Predicting Reliability of Power Electronics Modules | ICEPT 2007 | 2007 | 809 - 813 | |
| Hua Lu, Tim Tilford, Xiangdong Xue and Chris Bailey | Thermal-mechanical Modelling of Power Electronic Module Packaging | Eurosime07 | 2007 | 317 - 222 | |
| Wei-Sun Loh, Martin Corfield, Hua Lu, Simon Hogg, Tim Tilford, C Mark Johnson | Wire Bond Reliability for Power Electronic Modules - Effect of Bonding Temperature | Eurosime07 | 2007 | 427 - 432 | |
| C Bailey, H Lu, S Ridout, C Yin, T Tilford | Virtual Prototyping Tool for Reliability, Prognostics and Risk Assessment of Power Modules | ECPE seminar on virtual prototyping in power electronics | 2007 | ||
| Lu, H , Loh, WS, Tilford, T, Johnson, M, Bailey, C | Reliability of power electronic modules | IPACK2007 | 2007 | 2 | 883 - 888 |
| Hua Lu, Wei-Sun Loh, Chris Bailey and C Mark Johnson | Computer Modelling Analysis of the Globtop's Effects on Aluminium Wirebond Reliability | ESTC2008 | 2008 | 1&2 | |
| Hua Lu, Steve Ridout, Chris Bailey, Wei Sun Loh, Agyakwa Pearl and C Mark Johnson | Computer Simulation of the Crack Propagation in Power Electronics Module Solder Joint | ICEPT-HDP | 2008 | 1&2 | 250 -255 |
| Hua Lu, Wei-Sun Loh, Chris Bailey and C Mark Johnson | Computer Simulation of Aluminium Wirebonds with Globtop in Power Electronics Modules | IMPACT/EMAP | 2008 | 348-351 | |
| C. Bailey, H. Lu, C. Yin, S. Ridout | Reliability, Prognostics and Risk Assessment for Power Modules (Invited Keynote Paper) | the 5th International Conference on Integrated Power Electronics Systems | 2008 | ||
| J. Rizvi , R. Skuriat , T. Tilford, C. Bailey, C. M. Johnson and H. Lu | Modelling of Jet-Impingement Cooling for Power Electronics | Eurosime | 2009 | 107 - 111 | |
| Bailey, C; Lu, H; Tilford, T, et al | Co-Design and Multi-Physics Analysis for Power Electronic Modules (Invited Keynote Paper) | Eurosime | 2009 | 750 - 753 | |
| Bailey C, Chris, Lu H, Yin CY, | Modelling RELIABILITY OF POWER ELECTRONICS PACKAGING |
IPACK |
2009 |
||
| N. Wang and I. Cotton | Electrical Discharge in a Power Electronic Module |
XVth International Symposium on High Voltage Engineering |
2007 |
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| N. Wang, I. Cotton and K. Evans | The Impact Of Thermal Cycling In Humid Environments On Power Electronic Modules |
6th International Power Electronics and Motion Control Conference |
2009 |
||
| N. Wang, I. Cotton, J. Robertson, S. Follmann, K. Evans and D. Newcombe | Partial Discharge Control In A Power Electronic Module Using High Permittivity Non-Linear Dielectrics |
IEEE Transactions on Advanced Packaging |
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| N. Wang, I. Cotton and K. Evans | The Impact Of Thermal Cycling In Humid Environments On Power Electronic Modules |
IEEE Transactions on Advanced Packaging |
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| Paul J Palmer, Mark Johnson | A Joint IeMRC/EEP KTN Power Electronics Roadmap |
|
2008 |
1 - 24 | |
| Pearl A. Agyakwa, Martin R. Corfield, Jian Feng Li, Wei-Sun Loh, Enzo Liotti, Simon C. Hogg, C. Mark Johnson | Unusual Observations in the Wear-out of High Purity Aluminium Wire Bonds under Extended Range Passive Thermal Cycling |
IEEE Transactions on Device and Materials Reliability |
2010 |
10 | 254 - 262 |
| PA Agyakwa, MR Corfield, L Yang, JF Li, VMF Marques, C M Johnson | Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling |
Microelectronics Reliability |
2010 |
||
| R. Skuriat, C. M. Johnson | Direct substrate cooling of power electronics |
13th International Conference on Power Electronics and Applications EPE09 |
2009 |
1 - 10 | |
| Rizvi, M.J. Skuriat, R. Tilford, T. Bailey, C. Johnson, C.M. Lu, H. | Modelling of jet-impingement cooling for power electronics | 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. | 2009 | 1 - 5 | |
| N. Wang and I. Cotton | Electrical Discharge in a Power Electronic Module |
XVth International Symposium on High Voltage Engineering |
2007 |
||
| N. Wang, I. Cotton and K. Evans | The Impact Of Thermal Cycling In Humid Environments On Power Electronic Modules |
6th International Power Electronics and Motion Control Conference |
2009 |
||
| N. Wang, I. Cotton, J. Robertson, S. Follmann, K. Evans and D. Newcombe |
Partial Discharge Control In A Power Electronic Module Using High Permittivity Non-Linear Dielectrics |
IEEE Transactions on Advanced Packaging |
|
||
| N. Wang, I. Cotton and K. Evans |
The Impact Of Thermal Cycling In Humid Environments On Power Electronic Modules | IEEE Transactions on Advanced Packaging | |||
| Ming-Hung Weng, Rajat Mahapatra, Peter Tappin, Bing Miao, Sanatan Chattopadhyay, Alton Horsfall, Nick Wright |
High temperature characterization of high-k dielectrics on SiC | Materials Science in Semiconductor Processing | 2006 | ||
| Bing Miao, Rajat Mahapatra, Richard Jenkins, Jon Silvie, Nick Wright, Alton Horsfall |
Radiation induced change in defect density in HfO2-based MIM capacitors | EEE Transactions on Nuclear Science | 2009 | ||
| Bing Miao, Rajat Mahapatra, Nick Wright, Alton Horsfall |
The role of carbon contamination in voltage linearity and leakage current in high-k metal-insulator-metal capacitors | Journal of Applied Physics | 2008 | ||
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