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Challenges for electronic manufacturing posed by new surface contamination related failure modes in the context of the wireless revolution |
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AUTHOR(S) |
TITLE |
JOURNAL/CONFERENCE |
YEAR |
VOL. |
PAGE |
| Dou, G., Webb, D.P., Whalley, D.C., Hutt, D.A., and Wilson, A.R | Current Leakage Failure of Conformally Coated Electronic Assemblies |
2nd Electronics Systems-Integration Technology Conference, ESTC 2008, Greenwich, London, UK |
2008 |
1213 | |
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