Project Publication List |
|||||
|---|---|---|---|---|---|
Under bump metallization technologies for high sensitivity spectroscopic X-ray detectors |
|||||
| Return to main project list
|
|||||
AUTHOR(S) |
TITLE |
JOURNAL/CONFERENCE |
YEAR |
VOL. |
PAGE |
| J. Kaufmann, M. Desmulliez, Y. Tian, D. Price, M. Hughes, N. Strusevich, C. Bailey, C. Liu, and D. A. Hutt, | Megasonic agitation for enhanced electrodeposition of copper | Microsystem Technologies | 2009 | 15 | 1245 - 1254 |
| Y. Tian, C. Liu, D. A. Hutt, and B. Stevens, | Electrodeposition of Indium for Bump Bonding | 58th Electronic Components and Technology Conference | 2008 | 2096 - 2100 | |
| Y. Tian, J. Kaufmann, C. Liu, D. A. Hutt, B. Stevens, and M. P. Y. Desmulliez | Megasonic Enhanced Wafer Bumping Process to Enable High Density Electronics Interconnection | 2nd Electronics System-Integration Technology Conference | 2008 | 725 - 729 | |
| Y. Tian, D. A. Hutt, C. Liu, and B. Stevens, | High Density Indium Bumping through Pulse Plating Used for Pixel X-Ray Detectors | International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) | 2009 | 456 - 460 | |
| Y. Tian, C. Liu, D. A. Hutt, B. Stevens, D. Flynn, and M. P. Y. Desmulliez | High Density Indium Bumping Using Electrodeposition Enhanced by Megasonic Agitation | 11th Electronics Packaging Technology Conference | 2009 | 31 - 35 | |
IeMRC@lboro.ac.uk - ©2007 IeMRC |
 |
website design by CLANN |
|---|
