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Micro-interconnections Using Single Crystals

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AUTHOR(S)
TITLE
JOURNAL/CONFERENCE
YEAR
VOL.
PAGE
J.Liu, C. Liu, and P.P. Conway Crystallographic Features of Copper Column Growth by Reversible Pulse Current Electrodeposition Electronic Components and Technology Conference 2007    
J. Liu, C. Liu, and P.P. Conway Growth Mechanism of Copper Column by Electrodeposition for Electronic Interconnections Electronic System-integration Technology Conference 2008   679
J. Liu, C. Liu, and P.P. Conway Micro-interconnections Using Single Crystal 2nd IeMRC Conference 2007    
J. Liu, C. Liu, and P.P. Conway Electrodeposition of Single Crystal Copper Column for Microelectronic Instroduction IeMRC networking conference 2007    
   

 

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