Background

Research Fellow in the Interconnection Group at Loughborough since 2000, working mainly on the development of processes for manufacturing, packaging and integration of electronics and microsystems /MEMS. Previously spent four years at the City University of Hong Kong working on reliability of electronic packaging, and electronic processes in amorphous and organic device materials. MSc and PhD in solid state physics from the Universities of Dundee and Abertay Dundee respectively. BSc in Mathematical Physics from UMIST.

School Research Group

Interconnection Group

Research Interests and Activities

Joining processes for electronics, optoelectronics and microsystems
Processes for electrical and fluidic interconnection
Use of thermoplastics in electronics and microsystems packaging
Green manufacturing for electronics
Technology trends and roadmapping

External Activities

Member Institute of Electrical and Electronic Engineers (IEEE)
Member Institute of Physics (IOP)

• Invited lectures
“New packaging technologies for miniaturised products” at Design, Test and Manufacturing Technologies for Integrated Micro and Nano Systems, 1-4 Oct 2007, Lancaster University

• Journal referee
Referee for Journal of Applied Physics
Referee for Soldering and Surface Mount Technology Journal
Referee for IEEE Transactions on Components, Packaging and Manufacturing Technology

• Commercialisation of research
Consultant, TDAO Ltd 2001-2004

• Further evidence of esteem
Lecturer on Institute of Circuit Technology Foundation Course 2006, 2007,2008 (Trade Association short course)

Publications

View central admin publications database (new window)

Links

Patrick Webb's Home Page