Background

BEng (1981-5) in Materials from Nanjing University of Science and Technology China, MSc (1985-8) in Corrosion Wear and Protection from Chinese Academy of Science, and PhD (1993-6) in Engineering Design and Manufacture from Hull University UK. Previously Assistant Professor in the Chinese Academy of Science (1988-93), and Postdoctoral Researcher at Birmingham University (1997-2000). Join Loughborough University since 2000 as a Research Fellow, now a Senior Lecturer in Electronics Manufacture.

School Research Group

Manufacturing Processes
Interconnection Group

Research Interests and Activities

Broad Interests and expertise:
Materials and processes in manufacturing
Materials characterisation and testing
Innovative electronics manufacturing
Nano-materials for electronics interconnections
Surface science and engineering
Corrosion science and protection

Current research areas:
Micro- and nano- electronics integration
Materials deposition and patterning
Under bump metallisation (UBM) and wafer bumping processes
Microstructural and micro-mechanical characterisation
Bonding and assembly processes e.g. flip chip technology
Microelectronics integration of X-ray detectors
Reliability analysis: testing and simulations

Multifunctional 3D miniaturised devices
High density optoelectronics
3D waveguide integration with flexible substrates
‘All-digital’ printed electronics by ink jet technology
Micro-scale induction joining and sealing of microfluidic device
3D metallisation and patterning

‘Green’ electronics manufacturing
Lead free soldering for HDIs
Preservative coatings to enable fluxless soldering
Droplet Welding to enable lead free joining

External Activities

Professional affiliations:
Chartered Engineer of Engineering Council, UK
Member of Sciece and Technology Task Group, Materials IGT, UK, 2005
Senior member of Institute of Electrical and Electronics Engineers, Inc.
Member of Institute of Materials, Mineral and Mining
Member of Institute of Nanotechnology
Member of Institute of Circuit Technology

Visiting Professor of Harbin Institute of Technology, China

Major conference activity:
Committee member & Session Chair of IEEE international conferences:
Electronics Components and Technology Conference (ECTC), USA
Electronic Systemintegration Technology Conference (ESTC), Europe
High Density Microsystem Design and Packaging and Component Failure
Analysis (HDP), China
International Conference on Electronics Packaging Technology (ICEPT), China

Invited lectures:
Shenzhen Graduates School, Harbin Institute of Technology, China, July (2007)
KTH, Sweden, November (2006)
Chalmers University, Sweden, November (2006)
Tsinghua University, Beijing, China,September (2005)
Illinois Institute of Technology, Chicago, USA, March (2005)
Delft University, Netherlands, November (2004)
Harbin Institute of Technology, Harbin, China, July (2004)
Institute of Metals Research, Academia Sinica, Shenyang, China, July (2004)
The University of Western Ontario, London, Canada, April (2004)
University of Science and Technology Beijing, China, July (2002)

Invited papers:
‘Materials and Processes Issues in Fine Pitch Eutectic Flip Chip Interconnection ‘, IEEE Transactions on Components and Packaging Technologies, 29/2006:869-876.
6th Conference on High Density Microsystem (HDP’04), Shanghai, China, July (2004)
7thConference on High Density Microsystem (HDP’06), Shanghai, China, June (2004)
NPL SSTC Winter Conference, Teddington, NPL, 10th December (2003)

Journal referee:
IEEE Transactions on Components and Packaging Technologies, IEEE (CPMT)
ASME Transactions J. Electronics Packaging, ASME International
Surface & Coatings Technology, Elsevier Science SA Lausanne, Lausanne1
Journal of the Electrochemical Society, The Electrochemical Society, USA
Soldering & Surface Mount Technology, Emerald Journal
Journal of Electronics Manufacturing, World Scientific Press

Awards

Overseas Research Scholarship (ORS), CVCP-UK, 1993-1997.
Best Paper Award at 28th IEMT (SEMI, IEEE/CPMT), San Jose, USA, July 2003
Cookson Electronics Paper Award at 5th EMAP (IEEE/CPMT), Singapore, November 2003.

Publications

View central admin publications database (new window)

Teaching Responsibilities

Engineering Sciences 2 (MMA102): Mechanics of Materials
Materials and Manufacturing Processes (MMA601/604): Manufacturing Processes
Design and Manufacture of Consumer Products (MMF501): Manufacturing Processes
Manufacturing Process Technology (MMB600): Responsible Examiner
Design for All (MMB504): Group project

Links

Changqing Liu's Home Page