Background

BEng (1981-5) in Materials from Nanjing University of Science and Technology China, MSc (1985-8) in Corrosion Wear and Protection from Chinese Academy of Science, and PhD (1993-6) in Engineering Design and Manufacture from Hull University UK. Previously Assistant Professor in the Chinese Academy of Science (1988-93), and Postdoctoral Researcher at Birmingham University (1997-2000). Join Loughborough University since 2000 as a Research Fellow, now Professor of Electronics Manufacture.

School Research Group

Manufacturing Processes
Interconnection Group

Research Interests and Activities

Broad Interests and expertise:
Materials and processes in manufacturing
Materials characterisation and testing
Innovative electronics manufacturing
Nano-materials for electronics interconnections
Surface science and engineering
Corrosion science and protection

Current research areas:
Novel materials depositions, bonding assembly processes
Large scale ultra-fine pitch flip chip technology
Copper interconnects: wire and column bonding and interfaces
Wafer bumping with binary and ternary eutectic Pb-free alloys
3D waveguide integration with flexible substrates
Printed electronics using ink jet technology
Novel materials processing for compact optoelectronics integration
Lab on Chip (LoB) to enable multifunctional 3D miniaturised devices
Novel materials and processes for manufacture of solar cell modules
Electronics for severe, extreme and harsh environments
Reliability analysis of electronic products: testing and simulations
Surfaces and interfaces of electronics interconnects: microstructural and micro-mechanical characterisation

External Activities

Professional affiliations:

Chartered Engineer of Engineering Council, UK
Member of Sciece and Technology Task Group, Materials IGT, UK, 2005
Senior member of Institute of Electrical and Electronics Engineers, Inc.
Member of Institute of Materials, Mineral and Mining
Member of Institute of Nanotechnology
Member of Institute of Circuit Technology
Visiting Professor of Harbin Institute of Technology, China
Visiting Professor of Nanyang Technological University, Singapore

Major conference activity:

Committee member & Session Chair of IEEE international conferences:
Electronics Components and Technology Conference (ECTC), USA
Electronic Systemintegration Technology Conference (ESTC), Europe
Electronics Packaging Technology Conference (EPTC), Singapore
International Conference on Electronics Packaging Technology (ICEPT-HDP), China

Invited lectures:

The University  of Milan, Italy, 21st December 2010
Waterloo University, Waterloo, Canada, 16th April 2010
Nanyang Technological University, Singapore, 15th December 2009
Advanced Industrial Science and Technology (AIST), Tsukuba, Japan, 8th December 2009
Huazhong University of Science and Technology, Wuhan, China, 14th October 2009
Hong Kong University of Science and Technology, 30th July 2009
Shenzhen Graduates School, Harbin Institute of Technology, China, July (2007)
KTH, Sweden, November (2006)
Chalmers University, Sweden, November (2006)
Tsinghua University, Beijing, China,September (2005)
Illinois Institute of Technology, Chicago, USA, March (2005)
Delft University, Netherlands, November (2004)
Harbin Institute of Technology, Harbin, China, July (2004)
Institute of Metals Research, Academia Sinica, Shenyang, China, July (2004)
The University of Western Ontario, London, Canada, April (2004)
University of Science and Technology Beijing, China, July (2002)

Invited papers:

‘Materials and Processes Issues in Fine Pitch Eutectic Flip Chip Interconnection ‘, IEEE Transactions on Components and Packaging Technologies, 29/2006:869-876.
6th Conference on High Density Microsystem (HDP’04), Shanghai, China, July (2004)
7thConference on High Density Microsystem (HDP’06), Shanghai, China, June (2004)
NPL SSTC Winter Conference, Teddington, NPL, 10th December (2003)

Journal reviewing:

Reviewer of IEEE Transactions on Components and Packaging Technologies, IEEE (CPMT) Reviewer of ASME Transactions Journal of Electronics Packaging, ASME, USA
Reviewer of Surface & Coatings Technology, Elsevier Science
Reviewer of Journal of the Electrochemical Society, The Electrochemical Society, USA
Reviewer of Soldering & Surface Mount Technology, Emerald Journal
Reviewer of Corrosion Science, Elsevier Science
Reviewer of Scripta Materialia, Elsevier Science
Reviewer of Materials Letters, Elsevier Science
Reviewer of Microelectronics reliability, Elsevier Science
Reviewer of Journal of Materials Science and Engineering, Elsevier Science
Reviewer of Journal of Alloys and Compounds, Elsevier Science
Reviewer of Journal of Applied Polymer Science, Wiley Periodicals, Inc.

PhD thesis examination:

An external PhD Examiner at Waterloo University, Canada.
An external PhD Examiner at Birmingham University, UK.

Awards

Overseas Research Scholarship (ORS), CVCP-UK, 1993-1997.
Best Paper Award at 28th IEMT (SEMI, IEEE/CPMT), San Jose, USA, July 2003
Cookson Electronics Paper Award at 5th EMAP (IEEE/CPMT), Singapore, November 2003.

Publications

View central admin publications database (new window)

Teaching Responsibilities

Engineering Sciences 2 (MMA102): Mechanics of Materials
Materials and Manufacturing Processes (MMA601/604): Manufacturing Processes
Design and Manufacture of Consumer Products (MMF501): Manufacturing Processes
Manufacturing Process Technology (MMB600): Responsible Examiner
Design for All (MMB504): Group project