Design
tools include the full Mentor Graphics EDA suite
and Savansys for circuit design, simulation and
PCB layout. Finite element and finite difference
modelling software is also available for thermal
and thermal stress modelling.
Reliability
and testing
We
are equipped with the Marconi Checkmate Automatic
Test Equipment for bare board, in circuit and functional
testing. Reliability testing include: Damp heat/autoclave,
Temperature cycling, Dry heat, Board flex.
PCB Manufacturing
Processes
We
have a full plated through hole PCB manufacturing
facility, including CNC drilling, dry film resist
lamination, UV exposure, and a full range of wet
chemical processes (development, plating and etching).
Surface
mount PCB Assembly
We
have extensive capabilities for PCB Assembly, including
Screen printing, manual surface mount component
placement and a BGA/flip-chip placement station.
A range of soldering processes are also available,
including IR, Convective, Vapour phase, Hot bar
and Hot Air reflow systems.
Chip on board assembly including flip chip & wire
bonding
Chip
on board assembly:
Wafer probing
Die attach
Wire bonding (and wire bond testing)
Flip-chip wafer bumping
Flip-chip bonding
Specialised
test equipment
Specialised
instruments available include:
Nano-Indentor
3D non-contact surface topography
Wetting balance
X-ray radiography
IR thermography
Residual oxygen meter
Other
relevant sources at Loughborough
Other
relevant resources at Loughborough include: Surface
analysis laboratory (SIMS, LIMS, Auger, XPS, AFM
etc.)
Full hybrid manufacturing facility (Electrical
engineering department)
e-medic
e-medic seeks to explore the technological and
business potential of integrating advanced electronics and information
technologies with improved drug formulations into non-invasive drug
delivery devices, and their exploitation to maximum benefit in healthcare.
A platform device is researched based upon a pulmonary delivery system
that is flexible, programmable, and potentially will provide remote
patient monitoring through a distributed healthcare information system.
This project focuses on the development
of a lead-free joining technology using metal droplets.
Technological developments must not overlook environmental
health and safety concerns. Traditional joining
methods have often used solders of Pb-Sn composition,
which are now intended to be phased out. Thus, novel
processing methods must be sought to overcome this
problem and provide a cleaner more effective solution.
Design
tools include the full Mentor Graphics EDA suite
and Savansys for circuit design, simulation and
PCB layout. Finite element and finite difference
modelling software is also available for thermal
and thermal stress modelling.
We
are equipped with the Marconi Checkmate Automatic
Test Equipment for bare board, in circuit and functional
testing. Reliability testing include: Damp heat/autoclave,
Temperature cycling, Dry heat, Board flex. 
We
have a full plated through hole PCB manufacturing
facility, including CNC drilling, dry film resist
lamination, UV exposure, and a full range of wet
chemical processes (development, plating and etching).
We
have extensive capabilities for PCB Assembly, including
Screen printing, manual surface mount component
placement and a BGA/flip-chip placement station.
A range of soldering processes are also available,
including IR, Convective, Vapour phase, Hot bar
and Hot Air reflow systems.
Chip
on board assembly:
Specialised
instruments available include:
Other
relevant resources at Loughborough include: Surface
analysis laboratory (SIMS, LIMS, Auger, XPS, AFM
etc.)
