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Current
projects |
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Droplet Weld |
 |
>>more |
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e-medic |
 |
>>more |
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Flexelec - Large Area Cost Efficient Flexible
Circuits |
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>>more |
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Stratec |
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>>more |
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Past projects |
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Practice and Procurement: Alliances
in the Value Chain (Prime 3) |
>>more |
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Clean and Low-distortion Accurate
Welding for micro-assembly (CLAW) |
>>more |
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Lifecycle cost & configuration
of electronic assemblies (Prime 1) |
>>more |
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Low Cost Flip Chip Assembly |
>>more |
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Variable frequency to constant
frequency converter |
>>more |
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Frameworks for Producer Responsibility
in the Management of Step-Change Environmental Design |
>>more |
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Low cost Embedding of Electronics
within Injection Moulded Plastics (EMECMOLD) |
>>more |
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Anisotropic adhesives for fine
pitch interconnection |
>>more |
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End-of-life issues in telecommunications
products |
>>more |
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Technology convergence in China
and Eastern Europe |
>>more |
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Modelling and experimental investigation
of reflow soldering |
>>more |
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Engineering secondment to CALCE
electronic packaging research center |
>>more |
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New Manufacturing Processes for
Thin Walled Components |
>>more |
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Strategic and competitive implications
of recycling and design for disassembly in the electronics industry |
>>more |
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The globalisation of electronics
manufacture - the growth of electronics manufacturing |
>>more |
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Technology development and evolution:
electronics packaging and interconnect |
>>more |
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The use of loaded adhesives for
electronic interconnect |
>>more |
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Modelling of the soldering process
for surface mount devices |
>>more |
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Knowledge based control of adhesive
dispensing for SMD assembly |
>>more |
