Interconnection Group, Loughborough University

Journals

Journal of Electronics Manufacturing

The Journal of Electronics Manufacturing publishes quality technical papers associated with the manufacture and assembly of circuit boards, semiconductors and other components and the integration of these into products. Related subjects in materials opto-electronics and design are covered and important issues in business and management within the electronics industry are addressed. JEM is an independent, vertically integrated journal aimed at providing a unique interface between managers, researchers and application engineers working both in the academic and industrial communities.

Editor-in-Chief
Paul P. Conway
Wolfson School of Mechanical & Manufacturing Engineering
Loughborough University
Loughborough, Leics, LE11 3TU, UK
Tel: +44(0) 1509 227670
Fax: +44(0) 1509 227671
E-mail: P.P.Conway@lboro.ac.uk

Soldering & Surface Mount Technology

Soldering & Surface Mount Technology provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to all areas of soldering and surface mount technology. An accredited journal, Soldering & Surface Mount Technology complements its sister publications, Microelectronics International and Circuit World and is the official publication of the SMART Group (Surface Mount and Related Technologies) UK and Ireland.

Editor
David C. Whalley
Wolfson School of Mechanical & Manufacturing Engineering
Loughborough University
Loughborough, Leics, LE11 3TU, UK
Tel: +44(0) 1509 227661
Fax: +44(0) 1509 227671
E-mail: d.c.whalley@lboro.ac.uk

e-medic seeks to explore the technological and business potential of integrating advanced electronics and information technologies with improved drug formulations into non-invasive drug delivery devices, and their exploitation to maximum benefit in healthcare. A platform device is researched based upon a pulmonary delivery system that is flexible, programmable, and potentially will provide remote patient monitoring through a distributed healthcare information system.

This project focuses on the development of a lead-free joining technology using metal droplets. Technological developments must not overlook environmental health and safety concerns. Traditional joining methods have often used solders of Pb-Sn composition, which are now intended to be phased out. Thus, novel processing methods must be sought to overcome this problem and provide a cleaner more effective solution.