The Interconnection Group was formed in 1989, it nucleated around work in the control of adhesive dispensing for surface mount assembly and the generation of a concurrent process and product design tool for reflow soldering. Since then we have concentrated on the mechanical and manufacturing engineering issues associated with electronic products, drawing on the skills of electronics engineers, physicists, materials scientists and chemists.

Adhesives and solders have remained a major theme of the group over the years. Our work in adhesives has turned to understanding anisotropic adhesives in flip chip applications following work in isotropic die attach adhesives. Work in solders has now also moved towards both novel and low cost flip chip but we remain very involved in the construction of new generation reflow machines and alternative soldering machines building on our skills in control and instrumentation.

More recently our work has begun to seriously explore the issues associated with rework, substrate choice and packaging design - all in the context of steadily reducing dimensions. This work is soundly grounded in the materials, computational modelling and experimental skills grown over the years.