Interconnection Group, Loughborough University

Technological foci

A particular focus of the group has been the understanding and modelling of joining systems for electronics assembly. Following early work in the control of SMD adhesive dispensing, projects have addressed both solder and adhesive fine pitch joining systems and have had complementary modelling and experimental strands.

Computational finite element, finite difference and fluid dynamics modelling and mathematical modelling have been carried out of reflow soldering and isotropic and anisotropic adhesive assembly processes. Models and tools generated support product, process and materials design. Experimental programmes determine the process physics and key materials properties. Work initiated recently attempts to extend understanding of the couplings between electronic, mechanical and manufacturing process design; substrate and package choice and end-of-life (EOL) management issues in electronics. Other activities include thermal design and design optimisation, flip-chip assembly, rework, laser micro-welding and supply chain management.

e-medic seeks to explore the technological and business potential of integrating advanced electronics and information technologies with improved drug formulations into non-invasive drug delivery devices, and their exploitation to maximum benefit in healthcare. A platform device is researched based upon a pulmonary delivery system that is flexible, programmable, and potentially will provide remote patient monitoring through a distributed healthcare information system.

This project focuses on the development of a lead-free joining technology using metal droplets. Technological developments must not overlook environmental health and safety concerns. Traditional joining methods have often used solders of Pb-Sn composition, which are now intended to be phased out. Thus, novel processing methods must be sought to overcome this problem and provide a cleaner more effective solution.