 Much
of the work in adhesives has been in collaboration with
IVF, the Swedish Institute for Production Engineering
Research. Collaborations with NIST, USA have focused on
solder flow modelling. EOL management collaborators have
included Georgia Tech and Purdue University.
Work in the business area builds on collaboration with
the Harvard Business School. Collaboration in flip-chip
technology has included Georgia Tech and City University,
Hong Kong.
The group is also part of the European Adhesives in
Electronics Network. National collaborations have included
Cambridge, Greenwich, Imperial College London, King's
College London, Queen's University Belfast and Salford.
There are a number of other members of Manufacturing
Engineering that have complementary interests to the
group, Dr Andrew West (with skills in the application
of control engineering techniques) and Dr's Roy Jones
and Paul Leaney (the investigators of a series of teaching
companies with Celestica).
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